Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – Having glow discharge electrode gas energizing means
Reexamination Certificate
2011-07-05
2011-07-05
Kackar, Ram N (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
Having glow discharge electrode gas energizing means
Reexamination Certificate
active
07972469
ABSTRACT:
Embodiments of the present invention relate to plasma processing apparatus and methods of use thereof. In some embodiments, a plasma control magnet assembly includes a plurality of magnets arranged in a predetermined pattern that generate a magnetic field having a strength greater than 10 Gauss in a region proximate the assembly and less than 10 Gauss in a region remote from the assembly.
REFERENCES:
patent: 4739169 (1988-04-01), Kurosawa et al.
patent: 5772832 (1998-06-01), Collins et al.
patent: 6000360 (1999-12-01), Koshimizu
patent: 6014943 (2000-01-01), Arami et al.
patent: 6095084 (2000-08-01), Shamouilian et al.
patent: 6261428 (2001-07-01), Nozawa et al.
patent: 6333601 (2001-12-01), Wickramanayaka
patent: 6390020 (2002-05-01), Hu et al.
patent: 6432261 (2002-08-01), Watanabe et al.
patent: 6436251 (2002-08-01), Gopalraja et al.
patent: 6562189 (2003-05-01), Quiles et al.
patent: 6692617 (2004-02-01), Fu et al.
patent: 6758949 (2004-07-01), Wang et al.
patent: 6853141 (2005-02-01), Hoffman et al.
patent: 7232767 (2007-06-01), George et al.
patent: 7294224 (2007-11-01), Vesci et al.
patent: 7419567 (2008-09-01), Iwasaki et al.
patent: 2002/0101167 (2002-08-01), Shan et al.
patent: 2002/0130032 (2002-09-01), Ahn et al.
patent: 2003/0226641 (2003-12-01), Collins et al.
patent: 2005/0028935 (2005-02-01), Wickramanayaka et al.
patent: 62196819 (1987-08-01), None
patent: 01230771 (1989-09-01), None
patent: 5226297 (1993-09-01), None
patent: 2001196358 (2001-07-01), None
patent: 2002313784 (2002-10-01), None
patent: 2006056573 (2006-06-01), None
U.S. Office Action dated Dec. 22, 2009 for U.S. Appl. No. 11/738,507.
Bera Kallol
Collins Kenneth S.
Hanawa Hiroji
Horioka Keiji
Lindley Roger A.
Applied Materials Inc.
Crowell Michelle
Kackar Ram N
Moser IP Law Group
Taboada Alan
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