Plasma immersion ion implantation method using a pure or...

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region

Reexamination Certificate

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C438S516000, C257SE21057

Reexamination Certificate

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07968439

ABSTRACT:
Plasma immersion ion implantation employing a very high RF bias voltage on an electrostatic chuck to attain a requisite implant depth profile is carried out by first depositing a partially conductive silicon-containing seasoning layer over the interior chamber surfaces prior to wafer introduction.

REFERENCES:
patent: 3904505 (1975-09-01), Aisenberg
patent: 6589868 (2003-07-01), Rossman
patent: 7767561 (2010-08-01), Hanawa et al.
patent: 2005/0070073 (2005-03-01), Al-Bayati et al.
patent: 2005/0191827 (2005-09-01), Collins et al.
patent: 2006/0073683 (2006-04-01), Collins et al.
patent: 2008/0286982 (2008-11-01), Li et al.

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