Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2005-04-19
2005-04-19
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C257S431000, C257S433000, C438S048000, C438S064000
Reexamination Certificate
active
06882021
ABSTRACT:
Packaged microelectronic devices and methods of packaging microelectronic devices are disclosed herein. In one embodiment, the device includes an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side. The device further includes a window at the first side of the image sensor die and a lead mounted to the second side of the image sensor die. The window is radiation transmissive and positioned over the active area of the image sensor die. The lead is electrically coupled to the bond-pad on the image sensor die.
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Boon Suan Jeung
Chan Min Yu
Chia Yong Poo
Chua Swee Kwang
Eng Meow Koon
Flynn Nathan J.
Perkins Coie LLP
Quinto Kevin
LandOfFree
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