4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Physical configuration of semiconductor
  6. With electrical contact in hole in semiconductor

Suan Jeung Boon

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Adhesive layer for an electronic apparatus having multiple...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Castellated chip-scale packages and methods for fabricating...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing
Reexamination Certificate

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Castellation wafer level packaging of integrated circuit chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Castellation wafer level packaging of integrated circuit chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Castellation wafer level packaging of integrated circuit chips

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2332728

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