4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Physical configuration of semiconductor
  6. With electrical contact in hole in semiconductor

Swee Kwang Chua

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Castellation wafer level packaging of integrated circuit chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Castellation wafer level packaging of integrated circuit chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Leadless packaging for image sensor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate

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Leadless packaging for image sensor devices and methods of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Reexamination Certificate

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Method for packaging circuits

Metal working – Method of mechanical manufacture – Electrical device making
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Profile ID: LFUS-PAI-P-2332727

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