Negative resist or dry develop process for forming middle of...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S201000, C438S211000

Reexamination Certificate

active

07112489

ABSTRACT:
A method of implanting a middle of line (MOL) implant layer of a flash memory device that does not require a descumming step is disclosed. In a first embodiment, the method includes depositing a negative tone resist over the MOL implant layer. Portions of the negative tone resist in and above a plurality of trenches are not exposed to optical radiation, while portions surrounding the plurality of trenches are exposed. The unexposed portions are developed out thereby leaving a bottom surface of each trench substantially free of a resist residue. Implants can be placed in the MOL implant layer without the need for a descumming step. In a second embodiment, a bi-layer resist is deposited on the MOL implant layer, wherein the bi-layer resist includes a silicon containing top layer and a bottom layer. The bi-layer resist is patterned to expose a portion of the bottom layer that resides in and above a plurality of trenches. The bottom layer is dry etch developed using oxygen plasma as the etchant, thereby leaving a bottom surface of each trench substantially free of a resist residue. Implants can be placed in the MOL implant layer without the need for a descumming step.

REFERENCES:
patent: 4104070 (1978-08-01), Moritz et al.
patent: 5403435 (1995-04-01), Cathey et al.
patent: 5480819 (1996-01-01), Huang
patent: 5976740 (1999-11-01), Ausschnitt et al.
patent: 6814879 (2004-11-01), Shibata

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