Multiple stage process for cleaning process chambers

Details Multiple stage process for cleaning process chambers Multiple stage process for cleaning process chambers

2005-03-29

2005-03-29

Beck, Shrive P. (Department: 1763)

Etching a substrate: processes

Gas phase etching of substrate

Application of energy to the gaseous etchant or to the...

C216S075000, C216S079000, C134S001100, C134S021000, C134S022170, C134S002000, C438S710000, C438S721000, C438S723000

Reexamination Certificate

active

06872322

ABSTRACT:
A process for etching multiple layers on a substrate25in an etching chamber30and cleaning a multilayer etchant residue formed on the surfaces of the walls45and components of the etching chamber30. In multiple etching steps, process gas comprising different compositions of etchant gas is used to etch layers on the substrate25thereby depositing a compositionally variant etchant residue inside the chamber30. In one cleaning step, a first cleaning gas is added to the process gas to clean a first residue or to suppress deposition of the first residue onto the chamber surfaces. In a second cleaning step, another residue composition is cleaned off the chamber surfaces using a second cleaning gas composition.

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