Multilayer circuit board and method of manufacturing the same

Details Multilayer circuit board and method of manufacturing the same Multilayer circuit board and method of manufacturing the same

2005-12-06

2009-10-20

Chu, Chris C (Department: 2815)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S629000, C438S700000, C438S745000, C257SE23067, C257S700000, C029S852000

Reexamination Certificate

active

07605075

ABSTRACT:
A multilayer circuit board is provided that includes at least two insulating layers each sandwiched by circuit layers, thus having at least one internal circuit layer sandwiched by the at least two insulating layers. Via holes are formed in one or more of the insulating layers at the same pitch as bump electrodes of an integrated circuit chip, which permit insertion of the bump electrodes of an integrated circuit chip into the via holes of the multilayer circuit board. Metal films formed within the via holes are electrically connected to at least one of the circuit layers. An internal capacitor may be formed in a predetermined area of an insulating layer and predetermined areas of circuit layers which sandwich the predetermined area of the insulating layer and are opposed to each other. An internal resistor may be formed in an inner circuit layer.

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Office Action in Japanese counterpart application 2004-353236 dated Mar. 11, 2008.

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