4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Joseph Petrokaitis

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Alignment verification for C4NP solder transfer

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Apparatus and method for improving sensing margin of...

Static information storage and retrieval – Read/write circuit – Having fuse element
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Apparatus for providing uniaxial load distribution for...

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
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Apparatus for retaining a computer card

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Asymmetric source/drain junctions for low power silicon on...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Profile ID: LFUS-PAI-P-2165162

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