4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Ball or nail head type contact, lead, or bond

Chris C Chu

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Access cell design and a method for enabling automatic...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
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Adjustable thickness thermal interposer and electronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Chip package having with asymmetric molding and turbulent...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
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Chipcard with contact areas and method for producing contact...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
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Copper bonding compatible bond pad structure and method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
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Profile ID: LFUS-PAI-P-2343813

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