4. Metal fusion bonding
  5. Process
  6. Plural joints

Yasumitsu Orii

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Multilayer circuit board and method of manufacturing the same

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Soldering method and soldering apparatus

Metal fusion bonding – Process – Plural joints
Patent

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Profile ID: LFUS-PAI-P-1384633

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