Material or article handling – Process
Reexamination Certificate
2008-05-20
2008-05-20
Underwood, Donald (Department: 3652)
Material or article handling
Process
C414S744500
Reexamination Certificate
active
11398218
ABSTRACT:
A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.
REFERENCES:
patent: 4304433 (1981-12-01), Langowski
patent: 4348044 (1982-09-01), Wood, III
patent: 4410209 (1983-10-01), Trapani
patent: 4639028 (1987-01-01), Olson
patent: 4715637 (1987-12-01), Hosoda et al.
patent: 4724621 (1988-02-01), Hobson et al.
patent: 4778332 (1988-10-01), Byers et al.
patent: 4900214 (1990-02-01), Ben
patent: 5061144 (1991-10-01), Akimoto et al.
patent: 5125790 (1992-06-01), Foulke et al.
patent: 5133635 (1992-07-01), Malin et al.
patent: 5177563 (1993-01-01), Everett et al.
patent: 5520501 (1996-05-01), Kouno et al.
patent: 5636964 (1997-06-01), Somekh et al.
patent: 5700046 (1997-12-01), VanDoren et al.
patent: 5702228 (1997-12-01), Tamai et al.
patent: 5741113 (1998-04-01), Bacchi et al.
patent: 5756444 (1998-05-01), Walters et al.
patent: 5788453 (1998-08-01), Donde et al.
patent: 5919529 (1999-07-01), Matsumura
patent: 5938902 (1999-08-01), Nguyen et al.
patent: 5944476 (1999-08-01), Bacchi et al.
patent: 5955858 (1999-09-01), Kroeker et al.
patent: 5980187 (1999-11-01), Verhovsky
patent: 5980188 (1999-11-01), Ko
patent: 5988971 (1999-11-01), Fossey et al.
patent: 5989346 (1999-11-01), Hiroki
patent: 6053980 (2000-04-01), Suda et al.
patent: 6092971 (2000-07-01), Balg et al.
patent: 6098484 (2000-08-01), Bacchi et al.
patent: 6105454 (2000-08-01), Bacchi et al.
patent: 6116848 (2000-09-01), Thomas et al.
patent: 6132165 (2000-10-01), Carducci
patent: 6142722 (2000-11-01), Genov et al.
patent: 6166509 (2000-12-01), Wyka et al.
patent: 6167322 (2000-12-01), Holbrooks
patent: 6176667 (2001-01-01), Fairbairn et al.
patent: 6222337 (2001-04-01), Kroeker et al.
patent: 6256555 (2001-07-01), Bacchi et al.
patent: 6275748 (2001-08-01), Bacchi et al.
patent: 6293713 (2001-09-01), Ueda
patent: 6313596 (2001-11-01), Wyka et al.
patent: 6318948 (2001-11-01), Ueda et al.
patent: 6318951 (2001-11-01), Schmidt et al.
patent: 6322119 (2001-11-01), Schmidt et al.
patent: 6322312 (2001-11-01), Sundar
patent: 6438460 (2002-08-01), Bacchi et al.
patent: 6453214 (2002-09-01), Bacchi et al.
patent: 6454332 (2002-09-01), Govzman et al.
patent: 6514033 (2003-02-01), Sundar
patent: 6575177 (2003-06-01), Brown et al.
patent: 6614201 (2003-09-01), Saino et al.
patent: 6618645 (2003-09-01), Bacchi et al.
patent: 6678581 (2004-01-01), Hung et al.
patent: 6682113 (2004-01-01), Cox et al.
patent: 6685422 (2004-02-01), Sundar et al.
patent: 6692219 (2004-02-01), Coomer et al.
patent: 6729462 (2004-05-01), Babbs et al.
patent: 6752442 (2004-06-01), McNurlin et al.
patent: 6752585 (2004-06-01), Reimer et al.
patent: 6980187 (2005-12-01), Toriumi
patent: 6991710 (2006-01-01), Harris et al.
patent: 7053386 (2006-05-01), Holtam et al.
patent: 7100954 (2006-09-01), Klein et al.
patent: 7125059 (2006-10-01), Miyamoto
patent: 2003/0010449 (2003-01-01), Gramarossa et al.
patent: 2003/0052497 (2003-03-01), Holbrooks
patent: 2003/0052498 (2003-03-01), Holbrooks
patent: 2003/0151268 (2003-08-01), Holbrooks
patent: 2004/0091349 (2004-05-01), Tabrizle et al.
patent: 2005/0006916 (2005-01-01), Mantz
patent: 2005/0158153 (2005-07-01), Sundar et al.
patent: 2006/0045719 (2006-03-01), Bacchi et al.
patent: 2006/0165408 (2006-07-01), Akimoto et al.
patent: 2000-260858 (2000-09-01), None
patent: 2004-055697 (2004-02-01), None
patent: WO 2000/02808 (2000-01-01), None
Carlson Charles
Englhardt Eric
Hoskins Van
Hruzek Dean C.
Hudgens Jeffrey
Applied Materials Inc.
Patterson & Sheridan LLP
Underwood Donald
LandOfFree
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