Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-01-03
2009-02-03
Graybill, David E (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S738000, C257SE23021, C257SE23069, C257SE21508, C438S614000, C438S615000, C438S616000, C438S617000, C438S459000, C438S977000
Reexamination Certificate
active
07485562
ABSTRACT:
The present invention defines a packaging implementation providing a multichip multilayer system on a chip solution. Greater integration of a plurality and variety of known good die contained within cavities formed in a separate substrate is achieved. Additional redistribution and interconnect layers above the multichip configuration may be formed with the redistribution layers terminating in electrical connections such as conductive bumps or balls. In one embodiment, the substrate cavities receive signal device connections, such as conductive bumps, of a plurality of semiconductor dice in a flip-chip configuration. A portion of the substrate's back surface is then removed to a depth sufficient to expose the conductive bumps. In another embodiment, the cavities receive the semiconductor dice with their active surface facing up, wherein metal layer connections are formed and coupled to bond pads or other electrical connectors of the semiconductor dice. Computing systems incorporating the packaging are also disclosed.
REFERENCES:
patent: 3679941 (1972-07-01), LaCombe et al.
patent: 3903590 (1975-09-01), Yokogawa
patent: 4613891 (1986-09-01), Ng et al.
patent: 4714516 (1987-12-01), Eichelberger et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4866501 (1989-09-01), Shanefield
patent: 4878991 (1989-11-01), Eichelberger et al.
patent: 4884122 (1989-11-01), Eichelberger et al.
patent: 4894115 (1990-01-01), Eichelberger et al.
patent: 4918811 (1990-04-01), Eichelberger et al.
patent: 4933042 (1990-06-01), Eichelberger et al.
patent: 4937203 (1990-06-01), Eichelberger et al.
patent: 5019946 (1991-05-01), Eichelberger et al.
patent: 5048179 (1991-09-01), Shindo et al.
patent: 5055907 (1991-10-01), Jacobs
patent: 5073814 (1991-12-01), Cole et al.
patent: 5091769 (1992-02-01), Eichelberger
patent: 5094709 (1992-03-01), Eichelberger et al.
patent: 5108825 (1992-04-01), Wojnarowski et al.
patent: 5111278 (1992-05-01), Eichelberger
patent: 5144747 (1992-09-01), Eichelberger
patent: 5149662 (1992-09-01), Eichelberger
patent: 5154793 (1992-10-01), Wojnarowski et al.
patent: 5157589 (1992-10-01), Cole et al.
patent: 5161093 (1992-11-01), Gorczyca et al.
patent: 5169678 (1992-12-01), Cole et al.
patent: 5192716 (1993-03-01), Jacobs
patent: 5200810 (1993-04-01), Wojnarowski et al.
patent: 5206091 (1993-04-01), Beuhler et al.
patent: 5206712 (1993-04-01), Kornrumpf et al.
patent: 5225023 (1993-07-01), Wojnarowski et al.
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5250843 (1993-10-01), Eichelberger
patent: 5255431 (1993-10-01), Burdick
patent: 5257178 (1993-10-01), Hatfield et al.
patent: 5258647 (1993-11-01), Wojnarowski et al.
patent: 5280192 (1994-01-01), Kryzaniwsky
patent: 5285571 (1994-02-01), Gorczyca et al.
patent: 5300812 (1994-04-01), Lupinski et al.
patent: 5302547 (1994-04-01), Wojnarowski et al.
patent: 5315486 (1994-05-01), Fillion et al.
patent: 5324687 (1994-06-01), Wojnarowski
patent: 5331203 (1994-07-01), Wojnarowski et al.
patent: 5336928 (1994-08-01), Neugebauer et al.
patent: 5353195 (1994-10-01), Fillion et al.
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5355102 (1994-10-01), Kornrumpf et al.
patent: 5359496 (1994-10-01), Kornrumpf et al.
patent: 5366906 (1994-11-01), Wojnarowski et al.
patent: 5384691 (1995-01-01), Neugebauer et al.
patent: 5401687 (1995-03-01), Cole et al.
patent: 5422513 (1995-06-01), Marcinkiewicz et al.
patent: 5422514 (1995-06-01), Griswold et al.
patent: 5432675 (1995-07-01), Sorimachi et al.
patent: 5432677 (1995-07-01), Mowatt et al.
patent: 5434751 (1995-07-01), Cole et al.
patent: 5449427 (1995-09-01), Wojnarowski et al.
patent: 5452182 (1995-09-01), Eichelberger et al.
patent: 5455459 (1995-10-01), Fillion et al.
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5524339 (1996-06-01), Gorowitz et al.
patent: 5527741 (1996-06-01), Cole et al.
patent: 5546654 (1996-08-01), Wojnarowski et al.
patent: 5548099 (1996-08-01), Cole et al.
patent: 5554305 (1996-09-01), Wojnarowski et al.
patent: 5559363 (1996-09-01), Immorlica, Jr.
patent: 5561085 (1996-10-01), Gorowitz et al.
patent: 5565706 (1996-10-01), Miura et al.
patent: 5576517 (1996-11-01), Wojnarowski et al.
patent: 5658827 (1997-08-01), Aulicino et al.
patent: 5675310 (1997-10-01), Wojnarowski et al.
patent: 5683928 (1997-11-01), Wojnarowski et al.
patent: 5691245 (1997-11-01), Bakhit et al.
patent: 5736448 (1998-04-01), Saia et al.
patent: 5745984 (1998-05-01), Cole et al.
patent: 5757072 (1998-05-01), Gorowitz et al.
patent: 5786628 (1998-07-01), Beilstein et al.
patent: 5796164 (1998-08-01), McGraw et al.
patent: 5817541 (1998-10-01), Averkiou et al.
patent: 5841193 (1998-11-01), Eichelberger
patent: 5844304 (1998-12-01), Kata et al.
patent: 5849623 (1998-12-01), Wojnarowski et al.
patent: 5861322 (1999-01-01), Caillat et al.
patent: 5866952 (1999-02-01), Wojnarowski et al.
patent: 5872040 (1999-02-01), Wojnarowski et al.
patent: 5874770 (1999-02-01), Saia et al.
patent: 5888837 (1999-03-01), Fillion et al.
patent: 5897337 (1999-04-01), Kata et al.
patent: 5936305 (1999-08-01), Akram
patent: 5946546 (1999-08-01), Fillion et al.
patent: 5973908 (1999-10-01), Saia et al.
patent: 5998291 (1999-12-01), Bakhit et al.
patent: 5998859 (1999-12-01), Griswold et al.
patent: 6025258 (2000-02-01), Ochiai et al.
patent: 6040226 (2000-03-01), Wojnarowski et al.
patent: 6057593 (2000-05-01), Iovdalsky et al.
patent: 6093971 (2000-07-01), Oppermann et al.
patent: 6150719 (2000-11-01), Saia et al.
patent: 6159767 (2000-12-01), Eichelberger
patent: 6175161 (2001-01-01), Goetz et al.
patent: 6181569 (2001-01-01), Chakravorty
patent: 6214642 (2001-04-01), Chen et al.
patent: 6228687 (2001-05-01), Akram et al.
patent: 6229203 (2001-05-01), Wojnarowski
patent: 6236109 (2001-05-01), Hsuan et al.
patent: 6239367 (2001-05-01), Hsuan et al.
patent: 6239482 (2001-05-01), Fillion et al.
patent: 6239980 (2001-05-01), Fillion et al.
patent: 6242282 (2001-06-01), Fillion et al.
patent: 6255137 (2001-07-01), Gorczyca et al.
patent: 6271469 (2001-08-01), Ma et al.
patent: 6274391 (2001-08-01), Wachtler et al.
patent: 6284564 (2001-09-01), Balch et al.
patent: 6294407 (2001-09-01), Jacobs
patent: 6306680 (2001-10-01), Fillion et al.
patent: 6323096 (2001-11-01), Saia et al.
patent: 6350668 (2002-02-01), Chakravorty
patent: 6365438 (2002-04-01), Ishida et al.
patent: 6368896 (2002-04-01), Farnworth et al.
patent: 6389689 (2002-05-01), Heo
patent: 6389691 (2002-05-01), Rinne et al.
patent: 6396148 (2002-05-01), Eichelberger et al.
patent: 6396153 (2002-05-01), Fillion et al.
patent: 6423570 (2002-07-01), Ma et al.
patent: 6426545 (2002-07-01), Eichelberger et al.
patent: 6426564 (2002-07-01), Ball
patent: 6444560 (2002-09-01), Pogge et al.
patent: 6475877 (2002-11-01), Saia et al.
patent: 6489185 (2002-12-01), Towle et al.
patent: 6492737 (2002-12-01), Imasu et al.
patent: 6506664 (2003-01-01), Beyne et al.
patent: 6515370 (2003-02-01), Hashimoto
patent: 6518163 (2003-02-01), Sakuyama et al.
patent: 6521530 (2003-02-01), Peters et al.
patent: 6531022 (2003-03-01), Tsukahara
patent: 6548189 (2003-04-01), Gunasekaran et al.
patent: 6548329 (2003-04-01), Saia et al.
patent: 6555906 (2003-04-01), Towle et al.
patent: 6555908 (2003-04-01), Eichelberger et al.
patent: 6602739 (2003-08-01), Rose et al.
patent: 6617687 (2003-09-01), Akram et al.
patent: 6671948 (2004-01-01), Burdick et al.
patent: 6673698 (2004-01-01), Lin et al.
patent: 6706624 (2004-03-01), Kapusta et al.
patent: 6707124 (2004-03-01), Wachtler et al.
patent: 6709897 (2004-03-01), Cheng et al.
patent: 6709898 (2004-03-01), Ma et al.
patent: 6713859 (2004-03-01), Ma
patent: 6734534 (2004-05-01), Vu et al.
patent: 6737297 (2004-05-01), Pogge et al.
patent: 6746898 (2004-06-01), Lin et al.
patent: 6756662 (2004-06-01), Infantolino et al.
patent: 6759268 (2004-07-01), Akagawa
patent: 6767764 (2004-07-01), Saia et al.
patent: 6773962 (2004-08-01), Saia et al.
patent: 6774467 (2004-08-01), Horiuchi et al.
patent: 6774473 (2004-08-01), Shen
patent: 6785447 (2004-08-01), Yoshimura et a
Boon Suan Jeung
Chia Yong Poo
Chua Swee Kwang
Eng Meow Koon
Huang Suangwu
Graybill David E
Micro)n Technology, Inc.
TraskBritt
LandOfFree
Method of making multichip wafer level packages and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making multichip wafer level packages and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making multichip wafer level packages and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4123844