Method and apparatus for soldering modules to substrates

Details Method and apparatus for soldering modules to substrates Method and apparatus for soldering modules to substrates

2006-07-07

2009-08-04

Nguyen, Ha Tran T (Department: 2829)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S118000, C438S612000, C438S613000, C438S315000

Reexamination Certificate

active

07569474

ABSTRACT:
A method and apparatus for attaching a module such as a semiconductor device, having an array of contacts arranged thereon in a given pattern to a substrate such as a printed circuit board comprises applying an array of solder blocks to the array of contacts on the module. The module is then positioned on the substrate so that the array of solder blocks contacts the array of contact pads on the substrate. Heat is then applied to reflow the solder blocks to provide mechanical and electrical connection of the module to the substrate.

REFERENCES:
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patent: 5323947 (1994-06-01), Juskey et al.
patent: 5626278 (1997-05-01), Tang
patent: 5751068 (1998-05-01), McMahon et al.
patent: 6253675 (2001-07-01), Mayer
patent: 6426564 (2002-07-01), Ball
patent: 2001/0000905 (2001-05-01), Davis et al.
patent: 2002/0185713 (2002-12-01), Nakae
patent: 2002/0192936 (2002-12-01), Ball
patent: 2005/0056946 (2005-03-01), Gilleo

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