Method of forming fine patterns

Details Method of forming fine patterns Method of forming fine patterns

2007-03-13

2007-03-13

Young, Christopher G. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S313000, C430S315000, C430S322000, C430S330000, C427S271000, C427S372200, C427S384000, C427S385500, C438S760000

Reexamination Certificate

active

10602883

ABSTRACT:
It is disclosed a method of forming fine patterns comprising: covering a substrate having photoresist patterns with an over-coating agent for forming fine patterns, removing the unwanted over-coating agent that has been deposited on the edge portions and/or the back side of the substrate, applying heat treatment to cause thermal shrinkage of the over-coating agent so that the spacing between adjacent photoresist patterns is lessened by the resulting thermal shrinking action, and removing the over-coating agent substantially completely. The invention provides a method of forming fine patterns which has high ability to control pattern dimensions and provide fine patterns that have a satisfactory profile and satisfy the characteristics required of semiconductor devices, with an additional capability of preventing the occurrence of particles which are a potential cause of device contamination.

REFERENCES:
patent: 6486058 (2002-11-01), Chun
patent: 1314931 (2001-09-01), None
patent: 64-023535 (1989-01-01), None
patent: 1-307228 (1989-12-01), None
patent: 4-364021 (1992-12-01), None
patent: 5-166717 (1993-07-01), None
patent: 5-241348 (1993-09-01), None
patent: 7-45510 (1995-02-01), None
patent: 10-73927 (1998-03-01), None
patent: 11-204399 (1999-07-01), None
patent: 11-283910 (1999-10-01), None
patent: 2000-347414 (2000-12-01), None
patent: 2001-19860 (2001-01-01), None
patent: 2001-109165 (2001-04-01), None
patent: 2001-281886 (2001-10-01), None
“Extended Abstracts”, (The 42ndSpring Meeting, 1995);The Japan Society of Applied Physics and Related Societies,No. 2.
“Extended Abstracts”, (The 55thAutumn Meeting, 1994);The Japan Society of Applied Physics,No. 2.
Proceedings SPIE,vol. 4345, pp. 647-654.

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