Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-12-26
2006-12-26
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S462000, C257SE23061
Reexamination Certificate
active
07153724
ABSTRACT:
A series of grooves are etched in a leadframe to be used in fabricating a group of semiconductor packages at locations where the leadframe will later be sawed to separate the semiconductor packages. In variations of the process, the grooves may be wider or narrower than the kerf of the saw cuts and may be formed on the side of the leadframe facing towards or away from the entry of the saw blade.
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Chua Yee Heong
Jewjaitham Sitta
Nondhasitthichai Somchai
Sirinorakul Saravuth
Dolan Jennifer M.
Jr. Carl Whitehead
NS Electronics Bangkok (1993) Ltd.
Silicon Valley Patent & Group LLP
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