Method of fabricating no-lead package for semiconductor die...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

Reexamination Certificate

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C438S462000, C257SE23061

Reexamination Certificate

active

07153724

ABSTRACT:
A series of grooves are etched in a leadframe to be used in fabricating a group of semiconductor packages at locations where the leadframe will later be sawed to separate the semiconductor packages. In variations of the process, the grooves may be wider or narrower than the kerf of the saw cuts and may be formed on the side of the leadframe facing towards or away from the entry of the saw blade.

REFERENCES:
patent: 6399415 (2002-06-01), Bayan et al.
patent: 6452255 (2002-09-01), Bayan et al.
patent: 6483180 (2002-11-01), Bayan et al.
patent: 6489218 (2002-12-01), Kim et al.
patent: 6501158 (2002-12-01), Fazelpour et al.
patent: 6646339 (2003-11-01), Ku et al.
patent: 6667073 (2003-12-01), Lau et al.
patent: 6713849 (2004-03-01), Hasebe et al.
patent: 6734536 (2004-05-01), Kobayakawa
patent: 6743696 (2004-06-01), Jeung et al.
patent: 6812552 (2004-11-01), Islam et al.
patent: 2001/0042904 (2001-11-01), Ikenaga et al.
patent: 2002/0149090 (2002-10-01), Ikenaga et al.
patent: 2003/0073265 (2003-04-01), Hu et al.

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