4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

NS Electronics Bangkok (1993) Ltd.

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Flat no-lead semiconductor die package including stud terminals

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method of fabricating no-lead package for semiconductor die...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Method of fabricating semiconductor chip package using...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Process of fabricating semiconductor packages using...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Semiconductor package including organo-metallic coating...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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