4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Yee Heong Chua

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Method of fabricating no-lead package for semiconductor die...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Process of fabricating semiconductor packages using...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Semiconductor package including organo-metallic coating...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2959620

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