4. Chemistry: electrical and wave energy
  5. Apparatus
  6. Electrolytic

Somchai Nondhasitthichai

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Flat no-lead semiconductor die package including stud terminals

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method and apparatus for high speed singulation

Abrading – Precision device or process - or with condition responsive... – Controlling temperature
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Method and apparatus for no lead semiconductor package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Method and apparatus for no lead semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Method and apparatus for plating a semiconductor package

Chemistry: electrical and wave energy – Apparatus – Electrolytic
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Profile ID: LFUS-PAI-P-2236790

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