Method for tape automated bonding to composite bumps

Details Method for tape automated bonding to composite bumps Method for tape automated bonding to composite bumps

1996-04-03

2000-02-15

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

257737, 438614, H01L 2144

Patent

active

060242744

ABSTRACT:
A tape automated bonding (TAB) process in which a tape-carrier through its finger leads is bonded to composite bumps on an IC chip wherein the composite bumps are constructed by a polymeric material layer and at least one metal layer. The polymeric material layer has a lower rigidity (or a lower Young's modules) than those of the metal layers. Structural damages during the bonding process that is frequently caused by a rigid metal bump is eliminated. The TAB bonding process can be carried out by using either an all-metal lead frame, a plated metal lead frame, or a polymer reinforced metal lead frame. The polymer/metal composite bumps constructed on the IC chip require a smaller bonding force when bonded in a thermal bonder.

REFERENCES:
patent: 3922712 (1975-11-01), Stryker
patent: 4585157 (1986-04-01), Belcher
patent: 5166099 (1992-11-01), Ueda et al.
patent: 5393697 (1995-02-01), Chang et al.
patent: 5532186 (1996-07-01), Kobayashi
patent: 5707902 (1998-01-01), Chang et al.
Ward "Pressure Contact Type Chip Join Technique", IBM Technical Disclosure Bulletin, vol. 18 No. 9, p. 2817, Feb. 1976.

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