4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Su-Yu Fang

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Composite bump tape automated bonded structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Composite bump tape automated bonding method and bonded structur

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Method for tape automated bonding to composite bumps

Metal fusion bonding – Process – Plural joints
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Profile ID: LFUS-PAI-P-1143258

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