4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Jen-Huang Jeng

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Method for tape automated bonding to composite bumps

Metal fusion bonding – Process – Plural joints
Patent

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Nondestructive testing apparatus and method

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – By loading of specimen
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Structure for composite bumps

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Tape automated bonding apparatus with automatic leveling stage

Metal fusion bonding – Process – Plural joints
Patent

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Profile ID: LFUS-PAI-P-652401

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