4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Yu-Chi Lee

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Composite bump bonding

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Composite bump flip chip bonding

Metal fusion bonding – Process – Plural joints
Patent

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Composite bump flip chip bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Composite bump structure and methods of fabrication

Fishing – trapping – and vermin destroying
Patent

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Composite bump structure and methods of fabrication

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Profile ID: LFUS-PAI-P-537046

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