Method for forming C4 connections on integrated circuit...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S611000, C438S612000, C257S738000

Reexamination Certificate

active

07635643

ABSTRACT:
A method for forming preferably Pb-lead C4 connections or capture pads with ball limiting metallization on an integrated circuit chip by using a damascene process and preferably Cu metallization in the chip and in the ball limiting metallization for compatibility. In two one embodiment, the capture pad is formed in the top insulating layer and it also serves as the final level of metallization in the chip.

REFERENCES:
patent: 6426557 (2002-07-01), Daubenspeck et al.
patent: 2001/0013423 (2001-08-01), Dalal et al.
patent: 2003/0215984 (2003-11-01), Pogge et al.
patent: 2005/0012111 (2005-01-01), Howard et al.
patent: 2005/0104208 (2005-05-01), Bartelo et al.
patent: 2005/0158980 (2005-07-01), Seshan
patent: 2005/0191836 (2005-09-01), Tzeng et al.
patent: 2005/0224966 (2005-10-01), Fogel et al.
patent: 2005/0258540 (2005-11-01), Minda

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