4. Metal fusion bonding
  5. With means to cut or separate work, filler, flux, or product

Edward W. Brown

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Method and apparatus for completely covering a wafer with a...

Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate

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Method for forming C4 connections on integrated circuit...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Multi-level interconnections for an integrated circuit chip

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections
Reexamination Certificate

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Process and apparatus to remove closely spaced chips on a...

Metal fusion bonding – Process – With disassembling of bonded joint
Reexamination Certificate

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Process and apparatus to remove closely spaced chips on a...

Metal fusion bonding – With means to cut or separate work – filler – flux – or product
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2104463

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