4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Timothy H. Daubenspeck

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Antifuse for use with low &kgr; dielectric foam insulators

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections
Reexamination Certificate

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Antifuse for use with low k dielectric foam insulators

Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to conductive state
Reexamination Certificate

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Bilayer metallization cap for photolithography

Fishing – trapping – and vermin destroying
Patent

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Binary chlorofluorocarbon chemistry for plasma etching

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Chip dicing

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-94376

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