Method and apparatus for inspecting target defects on a wafer

Details Method and apparatus for inspecting target defects on a wafer Method and apparatus for inspecting target defects on a wafer

2006-08-01

2008-09-16

Stafira, Michael P (Department: 2886)

Optics: measuring and testing

By configuration comparison

With projection on viewing screen

C356S237200

Reexamination Certificate

active

07426031

ABSTRACT:
A defect inspecting apparatus includes a first support unit supporting a standard sample having standard defects, a second support unit supporting a wafer having target defects, a light source irradiating an incident light to the standard sample or the wafer, a light receiving part collecting reflection light reflected from the standard sample and the wafer, a detection part detecting the standard defects and the target defects by using the reflection light, a comparing part comparing information obtained using the reflection light reflected from the standard sample with a predetermined standard information of the standard defects to confirm a reliability of a step for detecting the target defects and a determination portion determining whether the step is allowed to be performed or not.

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English language abstract of Korean Publication No. 2003-0096478.
English language abstract of Japanese Publication No. 2003-090803.

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