Masked ion implant with fast-slow scan

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region

Reexamination Certificate

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C438S308000, C438S378000, C438S514000, C438S795000

Reexamination Certificate

active

08008176

ABSTRACT:
An improved method of producing solar cells utilizes a mask which is fixed relative to an ion beam in an ion implanter. The ion beam is directed through a plurality of apertures in the mask toward a substrate. The substrate is moved at different speeds such that the substrate is exposed to an ion dose rate when the substrate is moved at a first scan rate and to a second ion dose rate when the substrate is moved at a second scan rate. By modifying the scan rate, various dose rates may be implanted on the substrate at corresponding substrate locations. This allows ion implantation to be used to provide precise doping profiles advantageous for manufacturing solar cells.

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Masayoshi Hino et al., High Productivity Implantation “Partial Implant,” Ion Implantation Technology, 2008, pp. 312-315, American Institute of Physics.

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