Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-03-07
2006-03-07
Smith, Zandra V. (Department: 2826)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S666000, C257S674000, C257S676000
Reexamination Certificate
active
07008826
ABSTRACT:
A lead-frame-based semiconductor package and a fabrication method thereof are proposed. The semiconductor package includes: a lead frame having a plurality of first and second leads, wherein each first lead is formed with an extending portion smaller in thickness than the first lead in a manner that, an upper surface of the extending portion is flush with an upper surface of the first lead, and a lower surface of the extending portion forms a height difference with respect to a lower surface of the first lead; a chip mounted over the upper surfaces of the extending portions, and electrically connected to the leads by bonding wires; an encapsulant for encapsulating the upper surfaces of leads, upper surfaces of extending portions, chip and bonding wires; and a non-conductive material applied over the lower surfaces of extending portions, wherein the lower surfaces of leads are exposed to outside of the non-conductive material.
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Chen Holman
Hong Chin-Yuan
Hsu Chin-Teng
Huang Chien-Ping
Hung Jui-Hsiang
Baumgardner Mark A.
Corless Peter F.
Edwards Angell Palmer & Dodge
Jensen Steven M.
Siliconware Precision Industries Co. Ltd.
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