Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
Inventor
active
Dual-sided chip package without a die pad
Lead-frame-based semiconductor package and fabrication...
Lead-frame-based semiconductor package and fabrication...
Method for fabricating semiconductor package with...
Multi-chip semiconductor package
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Profile ID: LFUS-PAI-P-2511185