4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. For plural devices

Chin-Teng Hsu

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Adapter for high frequency signal transmission

Electrical connectors – With insulation other than conductor sheath – Plural-contact coupling part
Reexamination Certificate

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High frequency connector

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – For receiving coaxial connector
Reexamination Certificate

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Lead-frame-based semiconductor package and fabrication...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Lead-frame-based semiconductor package and fabrication...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method for fabricating semiconductor package with...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2707529

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