4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated

Chien-Ping Huang

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Array structure of solder balls able to control collapse

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Array structure of solder balls able to control collapse

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Array structure of solder balls able to control collapse

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Ball grid array integrated circuit package with palladium...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Ball grid array package

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2052546

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