4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

David Angell

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BiCMOS integration scheme with raised extrinsic base

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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End-point detection

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
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Internally reinforced bond pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Internally reinforced bond pads

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Micro electromechanical switch having self-aligned spacers

Electricity: electrothermally or thermally actuated switches – Electrothermally actuated switches – With bimetallic elements
Reexamination Certificate

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Profile ID: LFUS-PAI-P-321203

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