Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-05-08
2007-05-08
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Reexamination Certificate
active
10710706
ABSTRACT:
Methods for sealing an organic ILD layer and a metal layer after an etching step. The method includes etching through an ILD layer and leaving a remaining portion of an underlying metal layer cap, maintaining the device in an inert gas, and depositing at least a portion of a liner into the opening to seal the ILD layer and the metal layer. Subsequent processing may include formation of a via by etching through the portion of the liner and the remaining portion of the cap layer, and depositing a metal.
REFERENCES:
patent: 6399486 (2002-06-01), Chen et al.
patent: 6576546 (2003-06-01), Gilbert et al.
patent: 2004/0198055 (2004-10-01), Wang
Angyal Matthew S.
Biolsi Peter E.
Clevenger Lawrence A.
Hichri Habib
Kastenmeier Bernd E.
Harrison Monica D.
Hoffman Warnick & D'Alessandro LLC
International Business Machines - Corporation
Jaklitsch Lisa U.
Jr. Carl Whitehead
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