4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Peter E. Biolsi

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Damascene structure using a sacrificial conductive layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Interlevel dielectric layer and metal layer sealing

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method for forming damascene structure utilizing planarizing...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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Method of forming a damascene structure using a sacrificial...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2470443

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