4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Lisa U. Jaklitsch

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Advanced BEOL interconnect structures with low-k PE CVD cap...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Air gap under on-chip passive device

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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Alignment routine for optically based tools

Optics: measuring and testing – By alignment in lateral direction – With registration indicia
Reexamination Certificate

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Alignment routine for optically based tools

Optics: measuring and testing – By alignment in lateral direction – With registration indicia
Reexamination Certificate

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Apparatus and method for single die backside probing of...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
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Profile ID: LFUS-PAI-P-2331202

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