Integration manufacturing process for MEMS device

Details Integration manufacturing process for MEMS device Integration manufacturing process for MEMS device

2008-12-02

2011-10-04

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S048000, C438S052000

Reexamination Certificate

active

08030111

ABSTRACT:
A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures.

REFERENCES:
patent: 5919548 (1999-07-01), Barron et al.
patent: 6805454 (2004-10-01), Staker et al.
patent: 2004/0152229 (2004-08-01), Najafi et al.
patent: 2005/0205951 (2005-09-01), Eskridge
patent: 2006/0110854 (2006-05-01), Horning et al.
patent: 2006/0145793 (2006-07-01), Ning et al.

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