4. Electrical audio signal processing systems and devices
  5. Electro-acoustic audio transducer
  6. Having protective or sheilding feature

Hsueh-An Yang

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Integration manufacturing process for MEMS device

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate

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Microelectromechanical microphone packaging system

Electrical audio signal processing systems and devices – Electro-acoustic audio transducer – Having protective or sheilding feature
Reexamination Certificate

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Two-axis device and manufacturing method therefor

Electrical generator or motor structure – Non-dynamoelectric – Charge accumulating
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2188887

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