Integrated circuit leadframe with ground plane

Details Integrated circuit leadframe with ground plane Integrated circuit leadframe with ground plane

2006-06-20

2006-06-20

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

C257S670000, C257S676000, C257S692000, C257S784000, C361S723000, C361S773000, C361S813000, C438S123000, C029S827000

Reexamination Certificate

active

07064420

ABSTRACT:
A leadframe for a semiconductor package includes signal and ground leads, a ground plane, and a frame paddle. Supports connect the signal and ground leads, ground plane, and frame paddle in at least two different layers. At least one force release and stress relief structure is incorporated into the leadframe to free the ground plane substantially from distortion and warpage resulting from residual mechanical stresses therein.

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