4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Byung Joon Han

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Chip carrier and fabrication method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Chip carrier and fabrication method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Chip-scale semiconductor package of the fan-out type and...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Electronic device package enclosed by pliant medium laterally co

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Grid array type lead frame having lead ends in different planes

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Profile ID: LFUS-PAI-P-901104

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