Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Having enclosed cavity
Inventor
active
Die paddle enhancement for exposed pad in semiconductor...
Ground plane for exposed package
Ground plane for exposed package
Integrated circuit leadframe with ground plane
No associations
LandOfFree
Zheng Zheng does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Zheng Zheng, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Zheng Zheng will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2462729