4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. Small lead frame for connecting a large lead frame to a...

Byung Hoon Ahn

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Integrated circuit leadframe with ground plane

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Integrated circuit package system with down-set die pad and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Leadframe and semiconductor package made using the leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Method for fabricating semiconductor packages, and leadframe...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Moisture resistant integrated circuit leadframe package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2175796

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