In situ application of etch back for improved deposition...

Details In situ application of etch back for improved deposition... In situ application of etch back for improved deposition...

2005-01-13

2008-07-15

Chen, Kin-Chan (Department: 1792)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S702000, C438S714000

Reexamination Certificate

active

07399707

ABSTRACT:
A continuous in situ process of deposition, etching, and deposition is provided for forming a film on a substrate using a plasma process. The etch-back may be performed without separate plasma activation of the etchant gas. The sequence of deposition, etching, and deposition permits features with high aspect ratios to be filled, while the continuity of the process results in improved uniformity.

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