Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-11-14
2010-10-19
Malsawma, Lex (Department: 2892)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21509
Reexamination Certificate
active
07816251
ABSTRACT:
A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.
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Beroz Masud
Haba Belgacem
Kim Young-Gon
Tuckerman David B.
Lerner David Littenberg Krumholz & Mentlik LLP
Malsawma Lex
Tessera Inc.
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