David B. Tuckerman

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Back-face and edge interconnects for lidded package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Burn-in technologies for unpackaged integrated circuits

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Connection structures for microelectronic devices and...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Formation of circuitry with modification of feature height

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Formation of circuitry with modification of feature height

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-62950

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