4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Masud Beroz

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Assemblies for temporarily connecting microelectronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Assemblies for temporarily connecting microelectronic...

Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate

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Assemblies having stacked semiconductor chips and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Compliant lead structures for microelectronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Components with conductive solder mask layers

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Profile ID: LFUS-PAI-P-450253

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