4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Young-Gon Kim

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BGA package using a dummy ball and a repairing method thereof

Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent

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BGA package using a dummy ball and a repairing method thereof

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Components, methods and assemblies for multi-chip packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Components, methods and assemblies for stacked packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Components, methods and assemblies for stacked packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-140147

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