4. Chairs and seats
  5. Oscillating suspender connected to or through adjunctive rest
  6. Armrest or side frame-connected

Chih-Huang Chang

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Bump and fabricating process thereof

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Chip on glass package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Electric fan

Environmental heating and cooling; fluid handling and sanitary e – Heating or cooling – Air treatment
Design Patent

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Electric fan

Environmental heating and cooling; fluid handling and sanitary e – Heating or cooling – Air treatment
Design Patent

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Flip chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1748225

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