4. Electrical connectors
  5. Metallic connector or contact having part permanently...
  6. Adapted to be secured to conductor formed on printed circuit...

Yu-Wen Chen

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active

Chip package structure with dual heat sinks

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Edge mounted circuit board electrical connector

Electrical connectors – Metallic connector or contact having part permanently... – Adapted to be secured to conductor formed on printed circuit...
Patent

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Edge mounted circuit board electrical connector

Electrical connectors – Metallic connector or contact having part permanently... – Adapted to be secured to conductor formed on printed circuit...
Patent

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Face-to-face multi-chip flip-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Flip chip package and manufacturing method thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-293187

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