Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Reexamination Certificate
2007-09-04
2007-09-04
Vinh, Lan (Department: 1765)
Etching a substrate: processes
Gas phase etching of substrate
Application of energy to the gaseous etchant or to the...
C438S153000, C438S154000, C438S396000, C438S584000, C257S350000, C257S351000, C257S401000, C257S284000, C257S413000
Reexamination Certificate
active
11338464
ABSTRACT:
A method for forming fin structures is provided. Sacrificial structures are provided on a substrate. Fin structures are formed on the sides of the sacrificial structures. The forming of the fin structures comprises a plurality of cycles, wherein each cycle comprises a fin deposition phase and a fin profile shaping phase. The sacrificial structure is removed.
REFERENCES:
patent: 5716884 (1998-02-01), Hsue et al.
patent: 2001/0034114 (2001-10-01), Liaw
patent: 2006/0022262 (2006-02-01), Yoon et al.
Huang Zhi-Song
Reza Sadjadi S. M.
Angadi Maki
Beyer & Weaver, LLP
Lam Research Corporation
Vinh Lan
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